Handling of thermal management of intricate layered electronic assemblies

Handling of thermal management of intricate layered electronic assemblies

Wild Card's progress: nominated

This Wild Card came from: 
European Commission Framework Programme for RTD

The theme/scheme related to this Wild Card: 
Theme 3 - ICT - Information & communication technologies

The sub-theme that best relates to this Wild Card: 
Components, systems, engineering

Likelihood timeframe and scenario features : 
now-2025

Wild Card's description 
New technologies and materials for low thermal resistance interfaces and electrical interconnects have been discovered, which enable to eliminate obstacles with heat in intricate layered electronic assemblies. This technology makes possible to produce more integrated and more efficient electronic applications e.g. for hybrid vehicles and power supplies. Improved thermal management and integration densities for these applications will also be important to improve energy and manufacturing efficiency and component reliability.